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EP3HTS: Silver Filled, Fast Curing Epoxy

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Well suited for demanding manufacturing applications, EP3HTS is a one part, electrically conductive epoxy system featuring a fast cure schedule of 40-90 minutes at 250°F or 20-40 minutes at 300°F. Tensile shear strengths over 1,000 psi are obtained using these fast cure times. This system has a service temperature range of -60°F to +400°F.

For more information, request a technical data sheet on EP3HTS

FLM36: Toughened B-Staged Adhesive Film

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Master Bond FLM36 features a flexibilized epoxy chemistry that delivers high temperature resistance, thermal conductivity and electrical insulation. It retains very high physical strength properties up to 500°F while combining enhanced thermal and mechanical shock resistance and thermal cycling capabilities. As a film, it is very easy to handle and offers uniform bond line thicknesses and limited squeeze out during bonding.
For more information, request a technical data sheet on FLM36

EP42HT-2AO-1 Black: Cryogenically Serviceable Adhesive/Potting Compound

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EP42HT-2AO-1 Black features outstanding temperature and chemical resistance and is widely used in a variety of potting and encapsulation applications where thermal conductivity is needed. This cryogenically serviceable system also meets NASA low outgassing requirements.
For more information, request a technical data sheet on EP42HT-2AO-1 Black

EP21ARHT: Superior Acid Resistance

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Two component EP21ARHT is a high strength coating, liner and adhesive/sealant that is widely used in the chemical processing, metalworking, electronic and electrical industries. This high performance epoxy features low shrinkage and a low coefficient of thermal expansion while maintaining outstanding thermal shock and abrasion resistance. With a non-critical two to one mix ratio, EP21ARHT is easy to handle.
For more information, request a technical data sheet on EP21ARHT

UV24TKLO: NASA Low Outgassing Approved

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UV24TKLO is a one part UV curable epoxy modified formulation for bonding, sealing and encapsulation. This compound has excellent optical clarity, superb physical strength, superior electrical insulation properties and outstanding chemical resistance. Its low outgassing properties enable this product to be used in a wide array of optical, electro-optical and vacuum applications that until now have not been possible for UV curable systems.
For more information, request a technical data sheet on UV24TKLO

MasterSil 713: Low Viscosity, Fast Curing Silicone

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Master Bond MasterSil 713 is an easy to use, one component silicone system with exceptionally low viscosity for bonding, sealing, coating, encapsulations and formed-in-place gaskets. This self leveling system bonds well to a wide variety of substrates and cures quickly to form flexible, elastic properties. It is an outstanding electrical insulator over the wide temperature range of -75°F to +400°F. Its low viscosity also enables it to be used as a conformal coating.

For more information, request a technical data sheet on MasterSil 713
Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA
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